Highly Adhesive Seed Layer Forming Electroless Plating Process
Author:
Affiliation:
1. JCU CORPORATION
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/66/10/66_462/_pdf
Reference5 articles.
1. Polarization Curve in Electroless Copper Plating Containing EDTA as Complexing Agent
2. The Present and Future Trends in Electroless Copper Plating
3. 5) A. Hung ; Plat. Surf. Finish., 75, (1), 62 (1998).
4. 6) T. Sugiyama, Y. Imori, K. Baba, M. Watanabe, H. Honma ; J. Electro. Chem. Soc., 156, D360 (2009).
5. 7) M. Sugimoto, H. Honma ; J. Surf. Finish. Soc. Jpn., 59, 5 (2008).
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