Palladium Catalyst Residue Removal Process for the Purpose of Improving the Reliability of the Microcircuit
Author:
Affiliation:
1. Okuno Chemical Industries Co., Ltd.
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/65/8/65_368/_pdf
Reference2 articles.
1. The Characteristics of the New Catalyst Which Used Silver and the Application to the Printed Circuit Board.
2. Evaluation of Tin-Copper Mixed Catalyst for Replacement of Tin-Palladium Mixed Catalyst for Electroless Plating
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