Introduction for Fine Line Patterning Technology such as Line and Space 5 μm using by Surface Finishing Chemicals
Author:
Affiliation:
1. Technology Development Department, MELTEX INC.
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/65/8/65_357/_pdf
Reference1 articles.
1. Influence of Crystalline Texture on Etching Rate of Copper by Use of Sulfuric Acid/Hydrogen Peroxide Etching Solution
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1. Roughening Treatment of the Polishing Surface of Oxygen Free Copper Using NaCl-Electrolytic Oxidizing Water;Journal of the Japan Society for Precision Engineering;2023-01-05
2. Technology and Development Trends of the Thin Copper Foil with Carrier for PCB;Journal of The Surface Finishing Society of Japan;2017-09-01
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