Author:
Lin Shih-kang,Tsai Ming-yueh,Tsai Ping-chun,Hsu Bo-hsun
Publisher
Springer Science and Business Media LLC
Reference40 articles.
1. Reinhardt, K. C. & Marciniak, M. A., Wide-bandgap power electronics for the More Electric Aircraft, the 31st IntersocietyEnergy Conversion Engineering Conference (IECEC), Washington, D.C. IEEE. (10.1109/IECEC.1996.552858) (1996, Aug 11–16).
2. Dreike, P. L., Fleetwood, D. M., King, D. B., Sprauer, D. C. & Zipperian, T. E. An overview of high-temperature electronic device technologies and potential applications. IEEE T. Compon. Pack. A 17, 594–609, 10.1109/95.335047 (1994).
3. Oon, H. S. & Cheong, K. Y. Recent development of gallium oxide thin film on GaN. Mat. Sci. Semicon. Proc. 16, 1217–1231, 10.1016/j.mssp.2013.01.027 (2013).
4. Zeng, G., McDonald, S. & Nogita, K. Development of high-temperature solders: Review. Microelectron. Reliab. 52, 1306–1322, 10.1016/j.microrel.2012.02.018 (2012).
5. McCluskey, F., Dash, M., Wang, Z. & Huff, D. Reliability of high temperature solder alternatives. Microelectron. Reliab. 46, 1910–1914 (2006).
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献