Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance-Reference-Cited by-同舟云学术

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Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance

Published:2015-08-03 Issue:1 Volume:5 Page:
ISSN:2045-2322
Container-title:Scientific Reports
language:en
Short-container-title:Sci Rep

Author:

Rho Hokyun,Lee Seungmin,Bae Sukang,Kim Tae-Wook,Su Lee Dong,Jung Lee Hyun,Yeon Hwang Jun,Jeong Tak,Kim Sungmin,Ha Jun-Seok,Hyun Lee Sang

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://www.nature.com/articles/srep12710.pdf

Reference31 articles.

1. Mahajan, R., Chiu, C. P. & Chrysler, G. Cooling a microprocessor chip. Proc. IEEE 94, 1476–1486 (2006).

2. Krames, M. R. et al. Status and future of high-power light-emitting diodes for solid-state lighting. J. Disp. Technol. 3, 160–175 (2007).

3. Narendran, N. & Gu, Y. M. Life of LED-Based White Light Sources. J. Disp. Technol. 1, 167–171 (2005).

4. Xi, Y. & Schubert, E. F. Junction-temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method. Appl. Phys. Lett. 85, 2163–2165 (2004).

5. Brown, W. D. & Ulrich, R. K. Advanced electronic packaging. 2nd edn, (Wiley; IEEE, 2006).

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