Effect of encapsulation on electronic transport properties of nanoscale Cu(111) films
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-019-40193-6.pdf
Reference54 articles.
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3. Gambino, J. Process Technology for Copper Interconnects in Handbook of Thin Film Deposition (eds Seshan, K. & Schepis, D.) 147–194 (William Andrew, 2018).
4. Baklanov, M. R., Adelmann, C., Zhao, L. & De Gendt, S. Advanced Interconnects: Materials, Processing, and Reliability. ECS J. Solid State Sci. Technol. 4, Y1–Y4 (2015).
5. Hu, C.-K. et al. Atom motion of Cu and Co in Cu damascene lines with a CoWP cap. Appl. Phys. Lett. 84, 4986 (2004).
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