Dislocation loop and irradiation-induced synergistic-competitive mechanism in Cu-rich precipitates: a phase-field study

Author:

Yang Wenkui,Guo Qingwei,Wang Kaile,Lei Pengya,Hou Hua,Zhao Yuhong

Abstract

AbstractBoth irradiation and dislocations have been proposed as routes to rationally manipulate spatial distribution and micromorphology of precipitate. An interesting effect emerges in Fe–10at.%Cu–3at.%Mn–1.5at.%Ni–1.5at.%Al alloy due to the synergistic-competitive roles of dislocation loop and irradiation. Base on cascade mixing, vacancy-interstitial atoms and dislocation stress field model, we examine nucleation and growth dynamics of Cu-rich precipitates, where both dislocation loop and irradiation act in conjunction. Analytical treatments identify regimes, where the distribution of elements and point defects due to irradiation and dislocations are specific to the Cu-rich precipitates. Simulation results reveal that density, size and distribution of Cu-rich precipitates are a manifestation of the competing effects of the dislocation loop and the irradiation rate. More specifically, the dislocation loop preferentially assists the formation of precipitates and new dislocations at lower irradiation rates. Only the irradiation induces the formation of Cu-rich precipitates with the irradiation rate continues to increase. Equipped with molecular dynamics, where reproduces major interaction features of the solutes with point defects under displacement cascade, can verify multi-component morphologies of Cu-rich precipitates. This modeling framework provides an avenue to explore the role of dislocation loop and irradiation on the microstructural evolution of Cu-rich precipitates.

Funder

Shanxi graduate innovation project

National Natural Science Foundation of China

National Defense Basic Scientific Research Program of China

Key Research and Development Program of Shanxi Province

Science and Technology Major Project of Shanxi Province

Guiding Local Science and Technology Development Projects by the Central Government

Publisher

Springer Science and Business Media LLC

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