Phase-field simulation of dislocation interaction with damage loops created by irradiation in tungsten
Author:
Publisher
Elsevier BV
Subject
Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science
Reference30 articles.
1. Review of recent works in development and evaluation of high-Z plasma facing materials;Yoshida;J. Nucl. Mater.,1999
2. Comprehensive nuclear materials;Konings,2012
3. Fusion power: a challenge for materials science;Duffy;Philos. T. R. Soc. A,2010
4. Fundamentals of radiation materials science: metals and alloys;Was,2016
5. Mechanical properties of tungsten irradiated with high-energy protons and spallation neutrons;Habainy;J. Nucl. Mater.,2019
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3. Multi-Phase-Field Simulation of the Dynamic Dragging of Dislocation on the Solute Atoms and Point Defects;Journal of Materials Engineering and Performance;2023-07-17
4. Influence of kinetic effect on interaction between edge dislocation and irradiated dislocation loops in BCC Tantalum;International Journal of Plasticity;2023-06
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