Application of Hybrid Fillers for Improving the Through-Plane Heat Transport in Graphite Nanoplatelet-Based Thermal Interface Layers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/srep13108.pdf
Reference29 articles.
1. Schelling, P. K., Shi, L. & Goodson, K. E. Managing heat for electronics. Mater. Today 8, 30–35 (2005).
2. Prasher, R. Thermal interface materials: Historical perspective, status and future directions. Proc. IEEE 94, 1571–1586 (2006).
3. Moore, A. L. & Shi, L. Emerging challenges and materials for thermal management of electronics. Mater. Today 17, 163 (2014).
4. Xu, Y. S. & Chung, D. D. L. Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments. Compos. Interfaces 7, 243–256 (2000).
5. Cahill, D. G. et al. Nanoscale thermal transport. J. Appl. Phys. 93, 793–818 (2003).
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Pressure-induced tuning of thermal transport in carbon-based composites: Directional control of heat dissipation;Carbon;2023-11
2. Eco-friendly and scalable strategy to design electrically insulating boron nitride/polymer composites with high through-plane thermal conductivity;Composites Part B: Engineering;2023-01
3. Carbon fiber reinforced elastomeric thermal interface materials for spacecraft;Carbon;2022-02
4. Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects;IEEE Open Journal of Nanotechnology;2022
5. The addition of graphene nanoplatelets into epoxy/polycaprolactone composites for autonomous self-healing activation by Joule's heating effect;Composites Science and Technology;2021-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3