Resistive memories stack up
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials
Link
https://www.nature.com/articles/s41928-022-00804-z.pdf
Reference8 articles.
1. Verma, N. et al. IEEE Solid State Circuits Mag. 11, 43–55 (2019).
2. Ielmini, D. & Wong, H.-S. P. Nat. Electron. 1, 333–343 (2018).
3. Chen, W.-H. et al. Nat. Electron. 2, 420–428 (2019).
4. Chang, M. et al. In 2022 IEEE Int. Solid-State Circ. Conf. (ISSCC) 1–3 (IEEE, 2022); https://doi.org/10.1109/ISSCC42614.2022.9731679
5. Yin, S., Sun, X., Yu, S. & Seo, J.-S. IEEE Trans. Electron Dev. 67, 4185–4192 (2020).
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