Author Correction: The era of hyper-scaling in electronics
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials
Link
http://www.nature.com/articles/s41928-018-0132-y.pdf
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Remarkable Bias‐Stress Stability of Ultrathin Atomic‐Layer‐Deposited Indium Oxide Thin‐Film Transistors Enabled by Plasma Fluorination;Advanced Functional Materials;2024-06-09
2. T3L: A Practical Implementation of Tri-Transistor Ternary Logic Based on Inkjet-Printed Anti-Ambipolar Transistors and CMOSs of Thin-Film Structure;IEEE Transactions on Circuits and Systems I: Regular Papers;2023-12
3. Impact of Device Geometry, Physical Doping and Electrostatic Doping on the Frequency CV-dispersion of TFT Devices with IWO Channels;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07
4. Modeling and analysis of gate-induced drain leakage current in negative capacitance junctionless FinFET;Journal of Computational Electronics;2022-08-16
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