Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics-Reference-Cited by-同舟云学术

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Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics

Published:2013-10-10 Issue:1 Volume:3 Page:
ISSN:2045-2322
Container-title:Scientific Reports
language:en
Short-container-title:Sci Rep

Author:

Lee Chi Hwan,Kim Jae-Han,Zou Chenyu,Cho In Sun,Weisse Jeffery M.,Nemeth William,Wang Qi,van Duin Adri C. T.,Kim Taek-Soo,Zheng Xiaolin

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://www.nature.com/articles/srep02917.pdf

Reference30 articles.

1. Kim, M.-G., Kanatzidis, M. G., Facchetti, A. & Marks, T. J. Low-temperature fabrication of high-performance metal oxide thin-film electronics via combustion processing. Nat. Mater. 10, 382–388 (2011).

2. Lee, C. H., Kim, D. R. & Zheng, X. L. Fabricating nanowire devices on diverse substrates by simple transfer-printing methods. Proc. Nati. Acad. Sci. USA. 107, 9950–9955 (2010).

3. Carlson, A., Bowen, A. M., Huang, Y., Nuzzo, R. G. & Rogers, J. A. Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication. Adv. Mater. 24, 5284–5318 (2012).

4. Kim, S. et al. Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. Proc. Nati. Acad. Sci. USA. 107, 17095–17100 (2010).

5. Meitl, M. A. et al. Transfer printing by kinetic control of adhesion to an elastomeric stamp. Nat. Mater. 5, 33–38 (2006).

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