Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Materials Science (miscellaneous),Atomic and Molecular Physics, and Optics
Reference25 articles.
1. Ayazi F . Multi-DOF inertial MEMS: From gaming to dead reckoning. The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011); 5–9 Jun 2011; Beijing, China; 2011: 2805–2808.
2. Jeong Y, Serrano DE, Keesara V et al. Wafer-level vacuum-packaged triaxial accelerometer with nano airgaps. IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013); 20–24 Jan 2013; Taipei, China; 2013: 33–36.
3. Serrano DE, Jeong Y, Keesara V et al. Single proof-mass tri-axial pendulum accelerometers operating in vacuum. IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS 2014); 26–30 Jan 2014; San Francisco, CA, USA; 2014: 28–31.
4. Serrano DE, Lipka R, Younkin D et al. Environmentally-robust high-performance tri-axial bulk acoustic wave gyroscopes. IEEE/ION Position. Location and Navigation Symposium (PLANS 2016); 11–14 April 2016; Savannah, GA, USA; 2016: 5–8.
5. Zotov SA, Rivers MC, Trusov AA et al. Chip-scale IMU using folded-mems approach. IEEE Sensors; 1–4 Nov 2010; Waikoloa, HI, USA; 2010: 1043–1046.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献