Abstract
AbstractI have been developing MEMS (microelectromechanical systems) technology and supporting the industry through collaboration. A facility was built in house on a 20 mm square wafer for use in prototyping MEMS and ICs (integrated circuits). The constructed MEMS devices include commercialized integrated capacitive pressure sensors, electrostatically levitated rotational gyroscopes, and two-axis optical scanners. Heterogeneous integration, which is a MEMS on an LSI (large-scale integration), was developed for sophisticated systems using LSI made in a foundry. This technology was applied for tactile sensor networks for safe robots, multi FBAR filters on LSI, active-matrix multielectron emitter arrays, and so on. The facility used to produce MEMS on 4- and 6-inch wafers was developed based on an old semiconductor factory and has been used as an open hands-on access facility by many companies. Future directions of MEMS research are discussed.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Materials Science (miscellaneous),Atomic and Molecular Physics, and Optics
Reference25 articles.
1. Esashi, M. & Matsuo, T. Biomedical cation sensor using field effect of semiconductor. J. Jpn. Soc. Appl. Phys. 44(Suppl.), 339–343 (1975).
2. Shimada, K. et al. Application of catheter-tip I.S.F.E.T. for continuous in vivo measurement. Med. Biol. Eng. Comput. 18, 741–745 (1980).
3. Matsumoto, Y. & Esashi, M. An integrated capacitive absolute pressure sensor. Electron. Commun. Japan 76, 93–106 (1992).
4. Esashi, M. Wafer level packaging of MEMS. J. Micromech. Microeng. 18, 073001 (2006).
5. Nagata, T. et al. Digital compensated capacitive pressure sensor using CMOS technology for low-pressure measurements. Sens. Actuators A 34, 173–177 (1991).
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献