Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition-Reference-Cited by-同舟云学术

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Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition

Published:2014 Issue:6 Volume:82 Page:430-437
ISSN:1344-3542
Container-title:Electrochemistry
language:en
Short-container-title:Electrochemistry

Author:

TAKEUCHI Minoru,ANAMI Yoshihiro,YAMADA Yasutaka,BUNYA Masaru,OKADA Shoko,OKAMOTO Naoki,SAITO Takeyasu,YOKOI Masayuki,KONDO Kazuo

Publisher

The Electrochemical Society of Japan

Subject

Electrochemistry

Link

https://www.jstage.jst.go.jp/article/electrochemistry/82/6/82_13-E00048/_pdf

Reference14 articles.

1. 1) K. Kondo, T. Matsumoto, and K. Watanabe, J. Electrochem. Soc., 151, C250 (2004).

2. 2) N. T. M. Hai, J. Odermatt, V. Grimaudo, K. W. Krämer, A. Fluegel, M. Arnold, D. Mayer, and P. Broekmann, J. Phys. Chem. C, 116, 6913 (2012).

3. 3) S.-K. Kim, D. Josell, and T. P. Moffat, J. Electrochem. Soc., 153, C826 (2006).

4. 4) T. P. Moffat, D. Wheeler, S.-K. Kim, and D. Josellz, J. Electrochem. Soc., 153, C127 (2006).

5. 5) W.-P. Dow, H.-S. Huang, M.-Y. Yen, and H.-C. Huang, J. Electrochem. Soc., 152, C425 (2005).

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of ethylenediamine tetrakis(ethoxylate-block-propoxylate) tetrol on tin electrodeposition;Electrochimica Acta;2022-07

2. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown;Journal of The Electrochemical Society;2018

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