Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives
Author:
Affiliation:
1. Department of Chemistry and Biochemistry, University of Bern, Freiestr. 3, 3012 Bern, Switzerland
2. BASF SE, Global Business Unit Electronic Materials, 67056 Ludwigshafen, Germany
Publisher
American Chemical Society (ACS)
Subject
Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/jp2096086
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