Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites-Reference-Cited by-同舟云学术

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Published:2012-06-14 Issue:25 Volume:116 Page:13629-13639
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Huang Xingyi¹²,Iizuka Tomonori¹,Jiang Pingkai²,Ohki Yoshimichi³,Tanaka Toshikatsu¹

Affiliation:

1. IPS Research Center, Waseda University, Kitakyushu, Fukuoka, Japan

2. Department of Polymer Science and Engineering and Shanghai Key Lab of Electrical Insulation and Thermal Aging, Shanghai Jiao Tong University, 200240 Shanghai, China

3. Department of Electrical Engineering and Bioscience, Waseda University, Tokyo, Japan

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/jp3026545

Reference33 articles.

1. Towards Thermoconductive, Electrically Insulating Polymeric Composites with Boron Nitride Nanotubes as Fillers

2. Thermal Conductivity Improvement of Polymer Films by Catechin-Modified Boron Nitride Nanotubes

3. Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials

4. A review of dielectric polymer composites with high thermal conductivity

5. Ferroelectric polymer/silver nanocomposites with high dielectric constant and high thermal conductivity

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