Electrically insulating thermal interface material with ultrahigh thermal conductivity enabled by vertical boron nitride fibers

Abstract

With the increasing integration levels of modern electronic products, effective thermal management has become a critical concern to ensure the operational efficiency and longevity of electronic devices. Developing thermal interface materials that possess both high thermal conductivity (κ) and reliable insulation properties has presented a significant challenge. In this study, boron nitride fibers (BNF) with a substantial length-to-diameter ratio were fabricated to serve as vertically aligned thermal conduction channels within a composite pad containing a silicone gel matrix.Under typical packing pressure conditions, the resulting BNF pad exhibits an exceptionally high through-plane thermal conductivity (40 vol. %: κ⊥ = 16.77 W/mK). Additionally, the BNF pad demonstrates favorable mechanical and dielectric properties, enhancing its versatility and applicability. The results of actual heat dissipation tests further validate the excellent thermal management capabilities of these composites in high-power electronic applications.