Robust Copper-Based Nanosponge Architecture Decorated by Ruthenium with Enhanced Electrocatalytic Performance for Ambient Nitrogen Reduction to Ammonia-Reference-Cited by-同舟云学术

Robust Copper-Based Nanosponge Architecture Decorated by Ruthenium with Enhanced Electrocatalytic Performance for Ambient Nitrogen Reduction to Ammonia

Published:2023-02-22 Issue:9 Volume:15 Page:11703-11712
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Li Kui¹^ORCID,Ding Lei¹,Xie Zhiqiang¹,Yang Gaoqiang¹,Yu Shule¹,Wang Weitian¹,Cullen David A.²^ORCID,Meyer Harry M.³,Hu Guoxiang²,Ganesh Panchapakesan²^ORCID,Watkins Thomas R.⁴,Zhang Feng-Yuan¹^ORCID

Affiliation:

1. Nanodynamics and High-Efficiency Lab for Propulsion and Power, Department of Mechanical, Aerospace & Biomedical Engineering, UT Space Institute, University of Tennessee, Knoxville, Tullahoma, Tennessee 37388, United States

2. Center for Nanophase Materials Science, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831, United States

3. Chemical Sciences Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831, United States

4. Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831, United States

Funder

Office of Energy Efficiency and Renewable Energy

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c20809

Reference62 articles.