Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating
Author:
Affiliation:
1. School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
2. Lam Research Corporation, Fremont, California 94538, United States
Funder
Lam Research Corporation
Publisher
American Chemical Society (ACS)
Subject
General Physics and Astronomy,General Engineering,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsnano.7b01998
Reference30 articles.
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3. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art
4. PECVD low and ultralow dielectric constant materials: From invention and research to products
5. ALD Barrier Deposition on Porous Low-k Dielectric Materials for Interconnects
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