Decoding the Self-Assembly Plasmonic Interface Structure in a PbS Colloidal Quantum Dot Solid for a Photodetector

Author:

Guan Tianfu1ORCID,Chen Wei12ORCID,Tang Haodong3,Li Dong4,Wang Xiao2,Weindl Christian L.1ORCID,Wang Yawen4,Liang Zhiqiang4,Liang Suzhe1ORCID,Xiao Tianxiao1ORCID,Tu Suo1ORCID,Roth Stephan V.56ORCID,Jiang Lin4ORCID,Müller-Buschbaum Peter17ORCID

Affiliation:

1. Technical University of Munich, TUM School of Natural Sciences, Department of Physics, Chair for Functional Materials, James-Franck-Str. 1, 85748 Garching, Germany

2. Shenzhen Key Laboratory of Ultraintense Laser and Advanced Material Technology, Center for Advanced Material Diagnostic Technology, and College of Engineering Physics, Shenzhen Technology University, Shenzhen 518118, People’s Republic of China

3. College of Integrated Circuit and Optoelectronic Chips, Shenzhen Technology University, Shenzhen 518118, People’s Republic of China

4. Institute of Functional Nano & Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Soochow University, Suzhou 215123, People’s Republic of China

5. Deutsches Elektronen-Synchrotron (DESY), Notkestr. 85, 22607 Hamburg, Germany

6. KTH Royal Institute of Technology, Department of Fibre and Polymer Technology, Teknikringen 56-58, SE-100 44 Stockholm, Sweden

7. Heinz Maier-Leibniz Zentrum (MLZ), Technical University of Munich, Lichtenbergstraße 1, 85748 Garching, Germany

Funder

Technische Universit?t M?nchen

Science and Technology Foundation of Shenzhen City

Basic and Applied Basic Research Foundation of Guangdong Province

Deutsche Forschungsgemeinschaft

Center for NanoScience, Ludwig-Maximilians-Universit?t M?nchen

Bayerisches Staatsministerium f?r Bildung und Kultus, Wissenschaft und Kunst

Jiangsu Provincial Department of Science and Technology

China Scholarship Council

National Natural Science Foundation of China

Solar Technologies go Hybrid

Priority Academic Program Development of Jiangsu Higher Education Institutions

Higher Education Discipline Innovation Project

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

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