Low-Temperature Copper Bonding Strategy with Graphene Interlayer-Reference-Cited by-同舟云学术

Low-Temperature Copper Bonding Strategy with Graphene Interlayer

Author:

Wang Haozhe¹,Leong Wei Sun¹^ORCID,Hu Fengtian²,Ju Longlong²,Su Cong³,Guo Yukun²,Li Ju³^ORCID,Li Ming²,Hu Anmin²,Kong Jing¹^ORCID

Affiliation:

1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

2. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China

3. Department of Nuclear Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

Funder

Air Force Office of Scientific Research

Division of Electrical, Communications and Cyber Systems

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

Reference32 articles.

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