Author:
Wang Junqiang,Wang Qian,Wu Zijian,Tan Lin,Cai Jian,Wang Dejun
Funder
National Basic Research Program of China
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference31 articles.
1. Overview and outlook of through-silicon via (TSV) and 3D integrations;Lau;Microelectron. Int.,2011
2. Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies;Lai;Microelectron. Eng.,2011
3. Reliability of key technologies in 3D integration;Ko;Microelectron. Reliab.,2013
4. Low temperature bonding technology for 3D integration;Ko;Microelectron. Reliab.,2012
5. Reliable microjoints formed by solid-liquid interdiffusion (SLID) bonding within a chip-stacking architecture;Chang;IEEE Trans. CPMT,2012
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献