3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage-Reference-Cited by-同舟云学术

3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Published:2019-10-04 Issue:11 Volume:13 Page:12500-12510
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Jo Mansik¹,Bae Seunghwan²,Oh Injong³,Jeong Ji-hun³,Kang Byungsoo⁴,Hwang Seok Joon⁴,Lee Seung S.³,Son Hae Jung⁵^ORCID,Moon Byung-Moo¹,Ko Min Jae⁶^ORCID,Lee Phillip⁴^ORCID

Affiliation:

1. Department of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea

2. Intelligent Sustainable Materials R&D Group, Korea Institute of Industrial Technology (KITECH), Chungcheongnam 31056, Republic of Korea

3. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea

4. Division of Nano and Information Technology, KIST School, University of Science and Technology, Seoul 02792, Republic of Korea

5. Division of Energy and Environment Technology, KIST School, University of Science and Technology, Seoul 02792, Republic of Korea

6. Department of Chemical Engineering, Hanyang University, Seoul 04763, Republic of Korea

Funder

National Research Foundation of Korea

Korea Institute of Science and Technology

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.9b02362

Reference50 articles.

1. Highly conductive, printable and stretchable composite films of carbon nanotubes and silver

2. An ultra-lightweight design for imperceptible plastic electronics

3. Stretchable and Foldable Silicon Integrated Circuits

4. Skin-like pressure and strain sensors based on transparent elastic films of carbon nanotubes

5. Intrinsically stretchable and healable semiconducting polymer for organic transistors

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