Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices-Reference-Cited by-同舟云学术

Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Published:2020-12-28 Issue:1 Volume:4 Page:61-70
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Lassnig Alice¹^ORCID,Terziyska Velislava L.²,Zalesak Jakub¹,Jörg Tanja²,Toebbens Daniel M.³,Griesser Thomas⁴^ORCID,Mitterer Christian²,Pippan Reinhard¹,Cordill Megan J.¹²

Affiliation:

1. Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700 Leoben, Austria

2. Department of Materials Science, Montanuniversitaet Leoben, Franz-Josef-Strasse 18, 8700 Leoben, Austria

3. Helmholtz-Zentrum Berlin für Materialien und Energie (HZB), Albert-Einstein-Str. 15, 12489 Berlin, Germany

4. Institute of Chemistry of Polymeric Materials, Montanuniversitaet Leoben, Otto-Gloeckel-Straße 2, 8700 Leoben, Austria

Funder

Austrian Science Fund

Helmholtz-Zentrum Berlin

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

http://pubs.acs.org/doi/pdf/10.1021/acsanm.0c02182

Reference43 articles.

1. Mechanical properties of thin films

2. In situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate

3. Adhesion Measurement of Thin Films

4. VI. The phenomena of rupture and flow in solids

5. Interface Fracture

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