Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Author:

Wang Yuefeng12ORCID,Hong Yan1ORCID,Zhou Guoyun1,He Wei1ORCID,Gao Zhengping1,Wang Shouxu1,Wang Chong1,Chen Yuanming1,Weng Zesheng34,Wang Yongquan34

Affiliation:

1. School of Materials and Energy & State Key Laboratory of Electronic Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, People’s Republic of China

2. Department of Physics and Electronic Engineering, Yuncheng University, Yuncheng 044000, People’s Republic of China

3. Ganzhou Sun&Lynn Circuits Co., Ltd., Ganzhou 341000, People’s Republic of China

4. Shenzhen Sun&Lynn Circuits Co., Ltd., Shenzhen 518104, People’s Republic of China

Funder

National Natural Science Foundation of China

Jiangxi Province

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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