Efficient copper plating on glass substrates through amine-functionalized nanocomposite-immobilized silver nanoparticles-Reference-Cited by-同舟云学术

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Efficient copper plating on glass substrates through amine-functionalized nanocomposite-immobilized silver nanoparticles

Published:2024-05 Issue: Volume:688 Page:133581
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Chiang Tang-Lun,Cheng An-Yu,You Jhu-Lin^ORCID,Chang Chang-Pin,Ger Ming-Der^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Reference59 articles.

1. The evolution of Pd/Sn catalytic surfaces in electroless copper deposition;Cui;J. Electrochem. Soc.,2011

2. Chemical preparation of Pd nanoparticles in room temperature ethylene glycol system and its application to electroless copper deposition;Chen;J. Colloid Interface Sci.,2006

3. Pd nanoparticles as a new activator for electroless copper deposition;Lee;J. Electrochem. Soc.,2003

4. Fabrication of high-resolution conductive line via inkjet printing of nanopalladium catalyst onto PET substrate;Chen;Surf. Coat. Technol.,2011

5. Utilizing a pH-responsive palladium nanocomposite to fabricate adhesion-enhanced and highly reliable copper coating on nylon 6 fabrics;You;J. Mater. Res. Technol.,2021

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