Bi and Sn Co-doping Enhanced Thermoelectric Properties of Cu3SbS4 Materials with Excellent Thermal Stability-Reference-Cited by-同舟云学术

Bi and Sn Co-doping Enhanced Thermoelectric Properties of Cu3SbS4 Materials with Excellent Thermal Stability

Published:2020-01-28 Issue:7 Volume:12 Page:8271-8279
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Shen Manjie¹,Lu Siyu¹^ORCID,Zhang Zhuangfei¹^ORCID,Liu Hanyu²,Shen Weixia¹,Fang Chao¹^ORCID,Wang Qianqian¹,Chen Liangchao¹,Zhang Yuewen¹^ORCID,Jia Xiaopeng¹

Affiliation:

1. Key Laboratory of Material Physics of Ministry of Education, School of Physics and Microelectronics, College of Chemistry, Zhengzhou University, Zhengzhou 450052, China

2. Key Laboratory of Physics and Technology for Advanced Batteries (Ministry of Education) & Innovation Center for Computational Physics Methods and Software, College of Physics, Jilin University, Jilin 130012, China

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Henan Province

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b20854

Reference35 articles.

1. Low-cost, abundant binary sulfides as promising thermoelectric materials