Demonstration of Sputtering Atomic Layer Augmented Deposition: Aluminum Oxide–Copper Dielectric–Metal Nanocomposite Thin Films-Reference-Cited by-同舟云学术

Demonstration of Sputtering Atomic Layer Augmented Deposition: Aluminum Oxide–Copper Dielectric–Metal Nanocomposite Thin Films

Published:2020-03-04 Issue:12 Volume:12 Page:14280-14288
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Giraldo Brian¹,Fryauf David M.¹^ORCID,Cheney Brandon²,Sands Jacob H.¹,Kobayashi Nobuhiko P.¹^ORCID

Affiliation:

1. Nanostructured Energy Conversion Technology and Research (NECTAR), Department of Electrical and Computer Engineering, Baskin School of Engineering, University of California Santa Cruz, Santa Cruz, California 95064, United States

2. Department of Earth and Planetary Sciences, University of California Santa Cruz, Santa Cruz, California 95064, United States

Funder

Division of Civil, Mechanical and Manufacturing Innovation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b18628

Reference25 articles.

1. Integrating atomic layer deposition and ultra-high vacuum physical vapor deposition for in situ fabrication of tunnel junctions

2. Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor

3. Low-Temperature Atomic Layer Deposition of Copper Films Using Borane Dimethylamine as the Reducing Co-reagent

4. Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma

5. Permittivity enhancement of aluminum oxide thin films with the addition of silver nanoparticles

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1. Semiconductor-like optical properties unveiled by dispersion relation modeling of short-period aluminum oxide-copper multi-layered nanocomposites deposited by sputtering atomic layer augmented deposition (SALAD);Applied Materials Today;2023-12