Fabrication of Ag Complexes Based on Multidentate Ligands toward High-Efficient and Facile Electroless Plating-Reference-Cited by-同舟云学术

Fabrication of Ag Complexes Based on Multidentate Ligands toward High-Efficient and Facile Electroless Plating

Published:2022-06-09 Issue:24 Volume:10 Page:8075-8085
ISSN:2168-0485
Container-title:ACS Sustainable Chemistry & Engineering
language:en
Short-container-title:ACS Sustainable Chem. Eng.

Author:

Li Peng¹,Liu Xing¹,Zhang Ruxia¹²,Chen Zhenming¹³,Sun Di¹³,Huang Junjun¹⁴³^ORCID,Gui Chengmei¹⁴³^ORCID

Affiliation:

1. Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization, College of Materials and Chemical Engineering, Hezhou University, Hezhou City 542899, China

2. School of Materials and Optoelectronic Technology, University of Chinese Academy of Sciences, Beijin City 101400, China

3. School of Energy Materials and Chemical Engineering, Hefei University, Hefei City 230601, China

4. School of Chemistry and Chemical Engineering, Chaohu University, Hefei City 230009, China

Funder

Scientific Research Foundation of Education Department of Anhui Province of China

Anhui Provincial Key Research and Development Plan

Science and Technology Department of Guangxi Zhuang Autonomous

Young People Fund of Guangxi Science and Technology Department

Chaohu University 2021 university-level scientific research project

Youth Fund of Anhui Province

Chaohu University 2021 High-level Talents Research Start-up Fund

Innovation Project of Hefei University in 2021

Publisher

American Chemical Society (ACS)

Subject

Renewable Energy, Sustainability and the Environment,General Chemical Engineering,Environmental Chemistry,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.2c02241

Reference58 articles.

1. Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds

2. Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

3. Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition

4. Toward Control of Microstructure in Microscale Additive Manufacturing of Copper Using Localized Electrodeposition

5. A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates

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