Leaching Foams for Copper and Silver Dissolution: A Proof of Concept of a More Environmentally Friendly Process for the Recovery of Critical Metals-Reference-Cited by-同舟云学术

Leaching Foams for Copper and Silver Dissolution: A Proof of Concept of a More Environmentally Friendly Process for the Recovery of Critical Metals

Published:2021-10-12 Issue:42 Volume:9 Page:14022-14028
ISSN:2168-0485
Container-title:ACS Sustainable Chemistry & Engineering
language:en
Short-container-title:ACS Sustainable Chem. Eng.

Author:

Trinh Pierre¹,Mikhailovskaya Alesya¹,Zhang Mengxue²,Perrin Patrick¹,Pantoustier Nadège¹,Lefèvre Grégory²,Monteux Cécile¹^ORCID

Affiliation:

1. Laboratoire Sciences et Ingénierie de la Matière Molle, UMR 7615, ESPCI Paris, CNRS, PSL Research University, Sorbonne Université, 10 rue Vauquelin, 75231 Paris cedex 05, France

2. Institut de Recherche de Chimie Paris, Chimie Paristech, CNRS, PSL Research University, 75005 Paris cedex 05, France

Funder

Agence Nationale de la Recherche

Minist??re de l'Education Nationale, de l'Enseignement Superieur et de la Recherche

Sorbonne Universit??

Publisher

American Chemical Society (ACS)

Subject

Renewable Energy, Sustainability and the Environment,General Chemical Engineering,Environmental Chemistry,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.1c02258

Reference35 articles.

1. Global perspectives on e-waste

2. Challenges in Metal Recycling

3. Advances in Recovering Noble Metals from Waste Printed Circuit Boards (WPCBs)

4. Techniques to separate metal from waste printed circuit boards from discarded personal computers

5. A new technology for recycling materials from waste printed circuit boards

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Copper leaching with aqueous foams for the processing of electronic waste;Comptes Rendus. Chimie;2024-05-24

2. Investigation of the use of foams for silver leaching using the thiosulfate‑copper(II)-ammonia system in the context of e-waste recycling;Hydrometallurgy;2024-04

3. Relation between oxidation kinetics and reactant transport in an aqueous foam;Journal of Colloid and Interface Science;2023-08

4. Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach;Metals;2023-06-20

5. Probing foams from the nanometer to the millimeter scale by coupling small-angle neutron scattering, imaging, and electrical conductivity measurements;Soft Matter;2022