Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits
Author:
Affiliation:
1. State Key Lab of Chemical Engineering, Department of Chemical Engineering, Tsinghua University, Beijing Haidian district 100084, China
Funder
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
Renewable Energy, Sustainability and the Environment,General Chemical Engineering,Environmental Chemistry,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.1c04613
Reference48 articles.
1. Devising Materials Manufacturing Toward Lab‐to‐Fab Translation of Flexible Electronics
2. Flexible Multifunctional Sensors for Wearable and Robotic Applications
3. Effect of weight percentage gain on properties of electroless Ni–P plating on polyethylene terephthalate (PET) fabric
4. Printable Transparent Conductive Films for Flexible Electronics
5. Polymer‐Assisted Metal Deposition (PAMD) for Flexible and Wearable Electronics: Principle, Materials, Printing, and Devices
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