Monte Carlo Simulation of Electrodeposition of Copper: A Multistep Free Energy Calculation
Author:
Affiliation:
1. Department of Chemical Engineering, Tennessee Technological University, Cookeville, Tennessee 38505
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/jp076191a
Reference62 articles.
1. The electronic potential in a metal close to a surface edge
2. The chemistry of additives in damascene copper plating
3. Molecular dynamics, density functional theory of the metal–electrolyte interface
4. Romankiw, L. T.; Croll, I.; Hatzakis, M.IEEE Trans. Mag.1970,MAG-3, 597.
5. Fabrication of magnetic microstructures by using thick layer resists
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