Affiliation:
1. Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Illinois 60607-7022, United States
Funder
National Research Foundation of Korea
Ministry of Trade, Industry and Energy
Center for Inorganic Photovoltaic Materials
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Reference44 articles.
1. Thermal performance of aluminum-foam heat sinks by forced air cooling
2. Darnell, J. R.Copper Heat Sinks for Electronic Devices and Method of Making Same. U.S. Patent No. 3,829,598, Aug 13, 1974.
3. Chip cooling with integrated carbon nanotube microfin architectures
4. Sayir, H.; Mehmet, A.; Cooper, E.; Icoz, T.; Schaepkens, M.; Liu, X.Advanced Heat Sinks and Thermal Spreaders. U.S. Patent Application No. 200070053168, Mar 8, 2007.
Cited by
25 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献