Chip cooling with integrated carbon nanotube microfin architectures
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2714281
Reference18 articles.
1. Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
2. High-performance heat sinking for VLSI
3. Forced convective heat transfer across a pin fin micro heat sink
4. Phonons in carbon nanotubes
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