Computable Bulk and Interfacial Electronic Structure Features as Proxies for Dielectric Breakdown of Polymers-Reference-Cited by-同舟云学术

Computable Bulk and Interfacial Electronic Structure Features as Proxies for Dielectric Breakdown of Polymers

Published:2020-07-24 Issue:33 Volume:12 Page:37182-37187
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Kamal Deepak¹^ORCID,Wang Yifei²^ORCID,Tran Huan Doan¹^ORCID,Chen Lihua¹^ORCID,Li Zongze²,Wu Chao²,Nasreen Shamima²^ORCID,Cao Yang²^ORCID,Ramprasad Rampi¹^ORCID

Affiliation:

1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive NW, Atlanta, Georgia 30332, United States

2. Department of Materials Science and Engineering, University of Connecticut, Storrs, Connecticut 06269, United States

Funder

Office of Naval Research

Toyota Research Institute

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.0c09555

Reference36 articles.

1. Advanced polymeric dielectrics for high energy density applications

2. Hot-Carrier Dynamics and Chemistry in Dielectric Polymers

3. Atomistic mechanisms for chemical defects formation in polyethylene

4. Dielectric Breakdown Process of Polymers

5. Electric Breakdown of Solid and Liquid Insulators

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