Grain Boundary Segregation and Interdiffusion Effects in Nickel–Copper Alloys: An Effective Means to Improve the Thermal Stability of Nanocrystalline Nickel-Reference-Cited by-同舟云学术

Grain Boundary Segregation and Interdiffusion Effects in Nickel–Copper Alloys: An Effective Means to Improve the Thermal Stability of Nanocrystalline Nickel

Published:2011-06-27 Issue:7 Volume:3 Page:2265-2274
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Pellicer Eva,Varea Aïda,Sivaraman Kartik M.¹,Pané Salvador¹,Suriñach Santiago,Baró Maria Dolors,Nogués Josep²³,Nelson Bradley J.¹,Sort Jordi³

Affiliation:

1. Institute of Robotics and Intelligent Systems (IRIS), ETH Zurich, CH-8092 Zurich, Switzerland

2. CIN2(ICN-CSIC) and Universitat Autònoma de Barcelona, Catalan Institute of Nanotechnology, Campus de la UAB, 08193 Bellaterra (Barcelona), Spain

3. Institució Catalana de Recerca i Estudis Avançats (ICREA), 08010 Barcelona, Spain

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am2004587

Reference84 articles.

1. Nanostructured materials: basic concepts and microstructure

2. Low-temperature superplasticity in nanostructured nickel and metal alloys

3. Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

4. Plastic Deformation Recovery in Freestanding Nanocrystalline Aluminum and Gold Thin Films

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