Implementation of Epoxy Resin Composites Filled with Copper Nanowire-Modified Boron Nitride Nanosheets for Electronic Device Packaging
Author:
Affiliation:
1. School of Electrical Engineering and Automation, Hefei University of Technology, Hefei230009, China
2. China Electric Power Research Institute Co., Ltd, Wuhan, Hubei 430074, China
Funder
State Grid Corporation of China
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsanm.3c02977
Reference55 articles.
1. Thermal conductivity of polymer-based composites: Fundamentals and applications
2. Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
3. Highly Thermally Conductive Dielectric Nanocomposites with Synergistic Alignments of Graphene and Boron Nitride Nanosheets
4. Breaking Through Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics
5. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
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