Enhanced Corrosion Protection of Printed Circuit Board Electronics using Cold Atmospheric Plasma-Assisted SiO<sub><i>x</i></sub> Coatings-Reference-Cited by-同舟云学术

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Enhanced Corrosion Protection of Printed Circuit Board Electronics using Cold Atmospheric Plasma-Assisted SiO_x Coatings

Published:2024-09-02 Issue:36 Volume:16 Page:48293-48306
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Kasi Venkat¹²^ORCID,Tien Jia-Huei¹,Rahman Md Mahabubur²³,Rana Muhammad Masud²³,Heredia Rivera Ulisses Alberto¹²^ORCID,Shang Zhongxia²^ORCID,Vidhyadhiraja Advika²³,Zhang Jingxuan¹^ORCID,Youngblood Jeffrey P.¹^ORCID,Bahr David F.¹,Rahimi Rahim¹²³^ORCID

Affiliation:

1. School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, United States

2. Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States

3. School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States

Funder

School of Materials Engineering, Purdue University

Center for Surface Engineering and Enhancement, Purdue University

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c09751

Reference74 articles.

1. Industry 4.0: state of the art and future trends

2. Pfahl, R. C.; McElroy, J. B. Emerging Markets and Emerging Technologies. In 2007 International Symposium on High Density packaging and Microsystem Integration; IEEE: 2007. 10.1109/HDP.2007.4283589.

3. The 2021 flexible and printed electronics roadmap

4. All-Printed Flexible and Stretchable Electronics

5. Flexible Electronics: Status, Challenges and Opportunities

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