Abstract
Abstract
This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
Funder
Academy of Finland
Beijing Training Project for the Leading Talents
National key research and development program
National Institute of Biomedical Imaging and Bioengineering
Research Grants Council, Hong Kong
Ministry of Science and Technology of China
Ontario Graduate Scholarship
Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada
Air Force Research Laboratory
Strategic Priority Research Program of Chinese Academy of Sciences
Defense Advanced Research Projects Agency
Deutsche Forschungsgemeinschaft
National Research Foundation of Korea
National Natural Science Foundation of China
Horizon 2020 Framework Programme
NSF DMR
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
99 articles.
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