Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid-Reference-Cited by-同舟云学术

Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid

Published:2024-05-23 Issue:23 Volume:16 Page:30336-30343
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Lee Tae-Ik¹,Kim Ji Hun²,Kim Dong Jun²,Kim Taek-Soo²^ORCID

Affiliation:

1. Advanced Packaging and Integration Center, Joining R&D Group, KITECH, 156 Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Republic of Korea

2. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea

Funder

Ministry of Science and ICT, South Korea

Ministry of Trade, Industry and Energy

Korea Advanced Institute of Science and Technology

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c02279

Reference50 articles.

1. 60.1:Invited Paper: Low-Temperature Thermal CVD Process for Thin Film Encapsulation of Organic Light Emitting Devices

2. Progress in flexible organic thin-film transistors and integrated circuits

3. High performance polyimide films containing benzimidazole moieties for thin film solar cells

4. Thermal Transitions in Perfluorosulfonated Ionomer Thin-Films

5. A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Scalable Fabrication of Large‐Scale, 3D, and Stretchable Circuits;Advanced Materials;2024-07-22