Three-Dimensional Integrated Synaptic Devices Based on a Silver-Cluster Conduction Mechanism with High Thermostability-Reference-Cited by-同舟云学术

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Three-Dimensional Integrated Synaptic Devices Based on a Silver-Cluster Conduction Mechanism with High Thermostability

Published:2024-08-01 Issue:32 Volume:16 Page:42380-42391
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Li Mingjun¹,Li Ming¹^ORCID,An Jun Seop¹,An Haoqun²,Kim Dae Hun²,Lee Yong Hun²,Park Kwan Kyu³,Kim Tae Whan¹^ORCID

Affiliation:

1. Department of Electronics and Computer Engineering, Hanyang University, Seoul 04763, Republic of Korea

2. Research Institute of Industrial Science, Hanyang University, Seoul 04763, Republic of Korea

3. Department of Mechanical Engineering, Hanyang University, Seoul 04763, Republic of Korea

Funder

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c04957

Reference62 articles.

1. Reproducible Ultrathin Ferroelectric Domain Switching for High‐Performance Neuromorphic Computing

2. Nanostructured Materials and Architectures for Advanced Optoelectronic Synaptic Devices

3. Bridging Biological and Artificial Neural Networks with Emerging Neuromorphic Devices: Fundamentals, Progress, and Challenges

4. A Synaptic Transistor based on Quasi-2D Molybdenum Oxide

5. Recent Advances in Transistor‐Based Artificial Synapses

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