Multiscale Simulation Approach on Sub-10 nm Extreme Ultraviolet Photoresist Patterning: Insights from Nanoscale Heterogeneity of Polymer
Author:
Affiliation:
1. Mask Development Team, Samsung Electronics Co., Ltd., Suwon, Gyeonggi-do, Republic of Korea
Funder
Samsung
National Research Foundation of Korea
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.macromol.8b01290
Reference71 articles.
1. Extreme ultraviolet resist materials for sub-7 nm patterning
2. Semiconductor Logic Technology Innovation to Achieve Sub-10 nm Manufacturing
3. Radiation Chemistry in Chemically Amplified Resists
4. Direct Measurement of the Reaction Front in Chemically Amplified Photoresists
5. Molecular Glass Resists as High-Resolution Patterning Materials
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