Realizing Ultrauniform Films at Wafer Scale through the Magnetron Sputtering Method-Reference-Cited by-同舟云学术

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Realizing Ultrauniform Films at Wafer Scale through the Magnetron Sputtering Method

Published:2023-12-05 Issue:1 Volume:24 Page:339-346
ISSN:1528-7483
Container-title:Crystal Growth & Design
language:en
Short-container-title:Crystal Growth & Design

Author:

Cheng Zhengwang¹²³^ORCID,Fan Ruoyue¹²,Wang Aobo¹²,Li Quanshen¹²,Yu Jintao¹²,Bo Huating¹²,Li Shengjia¹²,Yang Zhihui¹²,Zou Wei¹²³,Fan Jinhu¹²³,Ma Xinguo¹²³^ORCID,Wang Mei¹²³^ORCID

Affiliation:

1. School of Science, Hubei University of Technology, Wuhan 430068, China

2. School of Chip Industry, Hubei University of Technology, Wuhan 430068, China

3. National “111 Research Center” Microelectronics and Integrated Circuits, Hubei University of Technology, Wuhan 430068, China

Funder

Hubei University of Technology

Hubei Provincial Department of Education

State Key Laboratory of Intelligence Manufacturing Equipment and Technology

Key Laboratory of Optoelectronic Chemical Materials and Devices of Ministry of Education, Jianghan University

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.cgd.3c01048

Reference30 articles.

1. Effect of sputtering power on structure and properties of ZTO films

2. Mn-Co-Ni-O thin films prepared by sputtering with alloy target

3. Physically Flexible, Rapid-Response Gas Sensor Based on Colloidal Quantum Dot Solids

4. The thickness uniformity of films deposited by magnetron sputtering with rotation and revolution

5. Reactive magnetron sputtering of thin films: present status and trends

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