Application of High-Throughput Seebeck Microprobe Measurements on Thermoelectric Half-Heusler Thin Film Combinatorial Material Libraries-Reference-Cited by-同舟云学术

Application of High-Throughput Seebeck Microprobe Measurements on Thermoelectric Half-Heusler Thin Film Combinatorial Material Libraries

Published:2017-12-21 Issue:1 Volume:20 Page:1-18
ISSN:2156-8952
Container-title:ACS Combinatorial Science
language:en
Short-container-title:ACS Comb. Sci.

Author:

Ziolkowski Pawel¹^ORCID,Wambach Matthias²,Ludwig Alfred²^ORCID,Mueller Eckhard¹³

Affiliation:

1. Institute of Materials Research, German Aerospace Center, D−51170 Cologne, Germany

2. Institute for Materials, Ruhr-University Bochum, D-44801 Bochum, Germany

3. Institute for Inorganic and Analytical Chemistry, Justus Liebig University Giessen, Heinrich-Buff-Ring 17, D-35392 Giessen, Germany

Funder

Deutsche Forschungsgemeinschaft

Publisher

American Chemical Society (ACS)

Subject

General Chemistry,General Medicine

Link

https://pubs.acs.org/doi/pdf/10.1021/acscombsci.7b00019

Reference74 articles.

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