Flexible and Micropatternable Triplet–Triplet Annihilation Upconversion Thin Films for Photonic Device Integration and Anticounterfeiting Applications-Reference-Cited by-同舟云学术

Flexible and Micropatternable Triplet–Triplet Annihilation Upconversion Thin Films for Photonic Device Integration and Anticounterfeiting Applications

Published:2018-02-14 Issue:10 Volume:10 Page:8985-8992
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Hagstrom Anna L.¹,Lee Hak-Lae²,Lee Myung-Soo²,Choe Hyun-Seok²,Jung Joori³,Park Byung-Geon⁴,Han Won-Sik³,Ko Jong-Soo⁴^ORCID,Kim Jae-Hong¹^ORCID,Kim Jae-Hyuk²^ORCID

Affiliation:

1. Department of Chemical and Environmental Engineering, Yale University, New Haven, Connecticut 06511, United States

2. Department of Chemical and Environmental Engineering, Pusan National University, 46241 Busan, Korea

3. Department of Chemistry, Seoul Women’s University, 01797 Seoul, Korea

4. Graduate School of Mechanical Engineering, Pusan National University, 48075 Busan, Korea

Funder

National Research Foundation of Korea

Division of Chemical, Bioengineering, Environmental, and Transport Systems

Publisher

American Chemical Society (ACS)

Subject

General Materials Science