Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects-Reference-Cited by-同舟云学术

Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects

Published:2018-11-15 Issue:47 Volume:10 Page:40608-40613
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Kaltwasser Mahsa¹,Schmidt Udo²,Biswas Shantonu¹,Reiprich Johannes¹,Schlag Leslie¹,Isaac Nishchay Angel¹,Stauden Thomas¹,Jacobs Heiko O.¹^ORCID

Affiliation:

1. Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, Ilmenau D-98693, Germany

2. Fachgebiet Elektrochemie und Galvanotechnik, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 6, Ilmenau D-98693, Germany

Funder

Carl-Zeiss-Stiftung

Deutsche Forschungsgemeinschaft

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b12390

Reference24 articles.

1. Wearable Electrochemical Sensors and Biosensors: A Review

2. Materials and Mechanics for Stretchable Electronics

3. 3D Metamorphic Stretchable Microphone Arrays

4. Deformable printed circuit boards that enable metamorphic electronics

5. EGaIn–Metal Interfacing for Liquid Metal Circuitry and Microelectronics Integration

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