EGaIn–Metal Interfacing for Liquid Metal Circuitry and Microelectronics Integration-Reference-Cited by-同舟云学术

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EGaIn–Metal Interfacing for Liquid Metal Circuitry and Microelectronics Integration

Published:2018-03-15 Issue:10 Volume:5 Page:1701596
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Ozutemiz Kadri Bugra¹^ORCID,Wissman James¹^ORCID,Ozdoganlar Osman Burak¹²³^ORCID,Majidi Carmel¹²³

Affiliation:

1. Department of Mechanical Engineering Carnegie Mellon University Pittsburgh PA 15213 USA

2. Department of Biomedical Engineering Carnegie Mellon University Pittsburgh PA 15213 USA

3. Department of Materials Science and Engineering Carnegie Mellon University Pittsburgh PA 15213 USA

Funder

Office of Naval Research

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.201701596

Reference68 articles.

1. Emerging Applications of Liquid Metals Featuring Surface Oxides

2. 25th Anniversary Article: The Evolution of Electronic Skin (E-Skin): A Brief History, Design Considerations, and Recent Progress

3. Eutectic Gallium-Indium (EGaIn): A Liquid Metal Alloy for the Formation of Stable Structures in Microchannels at Room Temperature

4. An ultra-lightweight design for imperceptible plastic electronics

5. Stretchable Silver Nanowire–Elastomer Composite Microelectrodes with Tailored Electrical Properties

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