Evaluation of Material Properties for Practical Microstructured Adhesives: Low Dust Adhesion and High Shear Strength
Author:
Affiliation:
1. Mechanical, Materials, and Aerospace Engineering, Illinois Institute of Technology, Chicago, Illinois 60616, United States
Funder
NASA SBIR
NASA Early Stage Innovations
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.8b19895
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