Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers-Reference-Cited by-同舟云学术

Less is More: Improved Thermal Stability and Plasmonic Response in Au Films via the Use of SubNanometer Ti Adhesion Layers

Published:2019-01-25 Issue:7 Volume:11 Page:7607-7614
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Abbott William M.¹^ORCID,Murray Christopher P.¹,Zhong Chuan¹,Smith Christopher¹,McGuinness Cormac¹,Rezvani Ehsan¹,Downing Clive¹,Daly Dermot¹,Petford-Long Amanda K.²³,Bello Frank¹,McCloskey David¹,Donegan John F.¹^ORCID

Affiliation:

1. School of Physics, CRANN, & AMBER, Trinity College Dublin, Dublin 2, Ireland

2. Materials Science Division, Argonne National Laboratory, Lemont, Illinois 60439, United States

3. Department of Materials Science & Engineering, Northwestern University, Evanston, Illinois 60208, United States

Funder

Basic Energy Sciences

Science Foundation Ireland

ASRC

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b21193

Reference36 articles.

1. Ultra-thin films for plasmonics: a technology overview

2. Gold in hybrid microelectronics

3. Dewetting behavior of electron-beam-deposited Au thin films on various substrates: graphenes, quartz, and SiO2 wafers

4. Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films

5. Titanium diffusion in gold thin films

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